Method and system for providing a quality metric for improved process control
US11372340B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2012 |
| Grant date | Jun 28, 2022 |
| Priority date | — |
| Expiry date | Aug 6, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2223/6116
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention may include acquiring a plurality of overlay metrology measurement signals from a plurality of metrology targets distributed across one or more fields of a wafer of a lot of wafers, determining a plurality of overlay estimates for each of the plurality of overlay metrology measurement signals using a plurality of overlay algorithms, generating a plurality of overlay estimate distributions, and generating a first plurality of quality metrics utilizing the generated plurality of overlay estimate distributions, wherein each quality metric corresponds with one overlay estimate distribution of the generated plurality of overlay estimate distributions, each quality metric a function of a width of a corresponding generated overlay estimate distribution, each quality metric further being a function of asymmetry present in an overlay metrology measurement signal from an associated metrology target.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.