Atomic layer deposition chamber with funnel-shaped gas dispersion channel and gas distribution plate

US11384432B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Muhammad M. Rasheed · San Jose, US
• Srinivas Gandikota · Santa Clara, US
• Mario D. Sanchez · San Jose, US
• Guoqiang Jian · San Jose, US
• Yixiong Yang · San Jose, US
• Deepak Jadhav · Gokul, IN
• Ashutosh Agarwal · Ghaziabad, IN

Key dates

• Filing date: Jun 9, 2015
• Grant date: Jul 12, 2022
• Expiry date: Jul 21, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J37/32834
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Methods and apparatus for processing a substrate are provided herein. In some embodiments, a substrate processing chamber includes: a chamber body; a chamber lid assembly having a housing enclosing a central channel that extends along a central axis and has an upper portion and a lower portion; a lid plate coupled to the housing and having a contoured bottom surface that extends downwardly and outwardly from a central opening coupled to the lower portion of the central channel to a peripheral portion of the lid plate; and a gas distribution plate disposed below the lid plate and having a plurality of apertures disposed through the gas distribution plate.