Integrated abrasive polishing pads and manufacturing methods

US11471999B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Ashavani Kumar · Sunnyvale, US
• Ashwin CHOCKALINGAM · San Jose, US
• Sivapackia Ganapathiappan · Palo Alto, US
• Rajeev Bajaj · Fremont, US
• Boyi Fu · San Jose, US
• Daniel Redfield · معلمی نژاد, US
• Nag B. Patibandla · Pleasanton, US
• Mario CORNEJO · San Jose, US
• Amritanshu Sinha · Sunnyvale, US
• Yan Zhao · Fushun, CN
• Ranga Rao Arnepalli · Krishna, IN
• Fred C. Redeker · Fremont, US

Key dates

• Filing date: Jul 23, 2018
• Grant date: Oct 18, 2022
• Expiry date: Apr 19, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/30625
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.