Machine vision as input to a CMP process control algorithm
US11577356B2 · kind B2 · utility
2Cited by
7References
19Claims
0Family size
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Key dates
| Filing date | Aug 28, 2019 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | Feb 24, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06N3/048
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
During chemical mechanical polishing of a substrate, a signal value that depends on a thickness of a layer in a measurement spot on a substrate undergoing polishing is determined by a first in-situ monitoring system. An image of at least the measurement spot of the substrate is generated by a second in-situ imaging system. Machine vision processing, e.g., a convolutional neural network, is used to determine a characterizing value for the measurement spot based on the image. Then a measurement value is calculated based on both the characterizing value and the signal value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.