System for cleaning semiconductor wafers
US11633765B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2021 |
| Grant date | Apr 25, 2023 |
| Priority date | — |
| Expiry date | Sep 9, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG08B25/08
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.