Apparatuses and methods of protecting nickel and nickel containing components with thin films
US11658014B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Apr 11, 2020 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Jun 23, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3321
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods and apparatus for depositing a coating on a semiconductor manufacturing apparatus component are provided herein. In some embodiments, a method of depositing a coating on a semiconductor manufacturing apparatus component includes: sequentially exposing a semiconductor manufacturing apparatus component including nickel or nickel alloy to an aluminum precursor and a reactant to form an aluminum containing layer on a surface of the semiconductor manufacturing apparatus component by a deposition process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.