Semiconductor processing system
US11749555B2 · kind B2 · utility
0Cited by
225References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2019 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Dec 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the disclosure relate to an apparatus and method for processing semiconductor substrates. In one embodiment, a processing system is disclosed. The processing system includes an outer chamber that surrounds an inner chamber. The inner chamber includes a substrate support upon which a substrate is positioned during processing. The inner chamber is configured to have an internal volume that, when isolated from an internal volume of the outer chamber, is changeable such that the pressure within the internal volume of the inner chamber may be varied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.