Methods for the treatment of workpieces
US11791181B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 18, 2020 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Mar 1, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/321
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods for thermal treatment of a workpiece are provided. In one example, a method for conducting a treatment process on a workpiece, such as a thermal treatment process, an annealing treatment process, an oxidizing treatment process, or a reducing treatment process in a processing apparatus is provided. The processing apparatus includes a plasma chamber and a processing chamber. The plasma chamber and the processing chamber are separated by a plurality of separation grids or grid plates. The separation grids or grid plates operable to filter ions generated in the plasma chamber. The processing chamber has a workpiece support operable to support a workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.