Conformal film thickness determination using angled geometric features and vertices tracking
US11876023B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2021 |
| Grant date | Jan 16, 2024 |
| Priority date | — |
| Expiry date | Jun 10, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/34
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention provide a method that includes forming an IC layer having an inactive region and an active region. The active region includes a device-under-fabrication (DUF). The inactive region includes a geometric feature having a geometric shape. A film is deposited over the active DUF and the geometric feature such that a first portion of the film will be part of the active DUF, and such that a second portion of the film is over the geometric feature. A geometric shape of the film over the geometric feature matches the geometric shape of the geometric feature. Determining a thickness of the film is based at least in part a difference between a footprint of the geometric shape of the film and a footprint of the geometric shape of the geometric feature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.