Lids and lid assembly kits for atomic layer deposition chambers

US11932939B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Muhammad M. Rasheed · San Jose, US
• Srinivas Gandikota · Santa Clara, US
• Mario D. Sanchez · San Jose, US
• Guoqiang Jian · San Jose, US
• Yixiong Yang · San Jose, US
• Deepak Jadhav · Gokul, IN
• Ashutosh Agarwal · Ghaziabad, IN

Key dates

• Filing date: Apr 28, 2021
• Grant date: Mar 19, 2024
• Expiry date: Jun 17, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J37/32834
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Apparatus for processing a substrate are provided herein. In some embodiments, a lid for a substrate processing chamber includes: a lid plate comprising an upper surface and a contoured bottom surface, the upper surface having a central opening and the contoured bottom surface having a first portion that extends downwardly and outwardly from the central opening to a peripheral portion of the lid plate and a second portion that extends radially outward along the peripheral portion of the lid plate; an upper flange extending radially outward from the lid plate; and one or more channels formed through the lid plate from the upper surface of the lid plate to the second portion of the contoured bottom surface.