Pin-less substrate transfer apparatus and method for a processing chamber
US11948828B2 · kind B2 · utility
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20Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 16, 2020 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | Jan 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure generally relates to a pin-less substrate transfer apparatus and method for a processing chamber. The processing chamber includes a pedestal. The pedestal includes a pedestal plate. The pedestal plate has a radius, a top surface, and a bottom surface. The pedestal plate further includes a plurality of cut outs on a perimeter of the pedestal plate. Flat edges are disposed on opposite sides of the pedestal plate. Recesses are disposed in the bottom surface below each of the flat edges.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.