Electrostatic chuck for high power plasma processing
US5350479A · kind A · utility
149Cited by
6References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1992 |
| Grant date | Sep 27, 1994 |
| Priority date | — |
| Expiry date | Dec 2, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck for holding an article to be processed in a plasma reaction chamber and comprising a metal pedestal coated with a layer of dielectric material in which is formed a cooling gas distribution system for passing and distributing a cooling gas between the upper surface of the layer and the article when supported on the pedestal. The gas distribution system comprises a plurality of intersecting grooves formed entirely in the upper surface of the layer with small gas distribution holes through intersections of the grooves over upper ends of cooling gas receiving holes formed in an underside of the pedestal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.