Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof
US5480503A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1993 |
| Grant date | Jan 2, 1996 |
| Priority date | — |
| Expiry date | Dec 30, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1142
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Process for producing circuitized greensheets including multi-layer ceramic sub-laminates and composites comprising thin ceramic greensheets carrying and thin, fine line patterned conductive metal layers. The invention comprises releasably-supporting the thin greensheets on a temporary carrier support having an ablatable release layer, preferably over a patterned conductive layer, and filling the vias with conductive metal paste, whereby the thin greensheets are supported against warpage and distortion. The supported greensheets are formed as single layers, pairs and stacks thereof, as desired, and thereafter separated from the temporary support for use.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.