Removable pumping channel liners within a chemical vapor deposition chamber

US5964947A · kind A · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Jun Zhao · Mianyang, CN
• Ashok Sinha · Palo Alto, US
• Avi Tepman · Cupertino, US
• Mei Chang · San Jose, US
• Lee Luo · Fremont, US
• Alex Schreiber · Santa Clara, US
• Talex Sajoto · San Jose, US
• Stefan Wolff · Sunnyvale, US
• Charles Dornfest · Fremont, US
• Michal Danek · Cupertino, US

Key dates

• Filing date: May 16, 1997
• Grant date: Oct 12, 1999
• Expiry date: May 16, 2017

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J2237/2001
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A substrate processing chamber, particularly a chemical vapor deposition (CVD) chamber used both for thermal deposition of a conductive material and a subsequently performed plasma process. The invention reduces thermal deposition of the conductive material in a pumping channel exhausting the chamber. The pumping channel is lined with various elements, some of which are electrically floating and which are designed so that conductive material deposited on these elements do not deleteriously affect a plasma generated for processing the wafer.