Method of inspecting a pattern on a substrate
US6376854B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 4, 2001 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | May 4, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/95607
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for inspecting a pattern formed on a substrate, includes the steps of moving a table along a first direction on which a substrate to be inspected is mounted, irradiating a converged electron beam on the substrate by scanning the converged electron beam along a second direction which is perpendicular to the first direction; detecting an electron radiated from the substrate by the irradiation of the converged electron beam in which the movement of the table and the scanning of the converged electron beam are synchronized; forming a digital image of the substrate from the detected electron; improving a quality of the digital image by filtering the digital image; and detecting a defect of a pattern formed on the substrate by using the improved quality digital image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.