Multi-fluid polishing process

US6572453B1 · kind B1 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Kapila Wijekoon · Santa Clara, US
• Stan Tsai · Clifton Park, US
• Yuchun Wang · Dhahran, SA
• Doyle E. Bennett · Santa Clara, US
• Fred C. Redeker · Fremont, US
• Madhavi R. Chandrachood · Sunnyvale, US
• Brian J. Brown · Eastleigh, GB

Key dates

• Filing date: May 18, 2000
• Grant date: Jun 3, 2003
• Expiry date: May 18, 2020

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C11D2111/22
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A polishing method is provided which simultaneously supplies both a polishing fluid and a conditioning fluid to a polishing pad, while a substrate is in moving contact with the polishing pad.