Semiconductor device fabrication chamber cleaning method and apparatus with recirculation of cleaning gas
US6863019B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2002 |
| Grant date | Mar 8, 2005 |
| Priority date | — |
| Expiry date | May 30, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02C20/30
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of cleaning a semiconductor fabrication processing chamber involves recirculation of cleaning gas components. Consequently, input cleaning gas is utilized efficiently, and undesirable emissions are reduced. The method includes flowing a cleaning gas to an inlet of a processing chamber, and exposing surfaces of the processing chamber to the cleaning gas to clean the surfaces, thereby producing a reaction product. The method further includes removing an outlet gas including the reaction product from an outlet of the processing chamber, separating at least a portion of the reaction product from the outlet gas, and recirculating a portion of the outlet gas to the inlet of the processing chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.