Patent · US Expired

Low Cu percentages for reducing shorts in AlCu lines

US6960306B2 · kind B2 · utility

0Cited by

3References

10Claims

0Family size

Assignees

Infineon Technologies AG · DE
International Business Machines Corporation · US

Inventors

Roy Iggulden · Newburgh, US
Padraic Shafer · Beacon, US
Kwong Hon Wong · Wappingers Falls, US
Michael Iwatake · Wappingers Falls, US
Jay William Strane · Wappingers Falls, US
Thomas Goebel · Wolfsberg, AT
Donna D. Miura · Hopewell Junction, US
Chet Dziobkowski · Hopewell Junction, US
Werner Robl · Regensburg, DE
Brian Hughes · Fort Collins, US

Key dates

Filing date	Jul 31, 2002
Grant date	Nov 1, 2005
Priority date	—
Expiry date	Oct 31, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH01L23/53219
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In a method of fabricating a metallization structure during formation of a microelectronic device, the improvement of reducing metal shorts in blanket metal deposition layers later subjected to reactive ion etching, comprising:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.