Electrical device allowing for increased device densities
US7084351B2 · kind B2 · utility
0Cited by
6References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2002 |
| Grant date | Aug 1, 2006 |
| Priority date | — |
| Expiry date | Oct 14, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10696
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be embodied on a circuit board, so that the circuit board includes a substrate and a deformable structure connected to said substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.