Substrate support having heat transfer system

US7221553B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Andrew Nguyen · San Jose, US
• Wing Cheng · Sunnyvale, US
• Hiroji Hanawa · Sunnyvale, US
• Semyon L. Kats · San Francisco, US
• Kartik Ramaswamy · San Jose, US
• Yan Ye · Saratoga, US
• Kwok Manus Wong · San Jose, US
• Daniel J. Hoffman · Saratoga, US
• Tetsuya Ishikawa · Fuji, JP
• Brian Lue · Mountain View, US

Key dates

• Filing date: Apr 22, 2003
• Grant date: May 22, 2007
• Expiry date: Apr 18, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67109
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A support for a substrate processing chamber has upper and lower walls that are joined by a peripheral sidewall to define a reservoir. A fluid inlet supplies a heat transfer fluid to the reservoir. In one version, a plurality of protrusions extends into the reservoir to perturb the flow of the heat transfer fluid through the reservoir. In another version, the reservoir is an elongated channel having one or more of (i) serpentine convolutions, (ii) integral fins extending into the channel, (iii) a roughened internal surface, or (iv) a changing cross-section. A fluid outlet discharges the heat transfer fluid from the reservoir.