Method of fabricating a stacked die in die BGA package
US7309623B2 · kind B2 · utility
34Cited by
52References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2006 |
| Grant date | Dec 18, 2007 |
| Priority date | — |
| Expiry date | Aug 29, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.