Semiconductor component with plastic housing, and process for producing the same

US7327023B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Ulrich Bachmaier · Ruderting, DE
• Michael Bauer · Nittendorf, DE
• Robert-Christian Hagen · Sarching, DE
• Jens Pohl · San Luis Obispo, US
• Rainer Steiner · Regensburg, DE
• Peter Strobel · Regensburg, DE
• Hermann Vilsmeier · Regensburg, DE
• Holger Woerner · Regensburg, DE
• Bernhard Zuhr · Regensburg, DE

Key dates

• Filing date: Oct 11, 2005
• Grant date: Feb 5, 2008
• Expiry date: Jan 4, 2026

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.