Conductive pad with ion exchange membrane for electrochemical mechanical polishing

US7344432B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Liang-Yun Chen · Foster City, US
• Yuchun Wang · Dhahran, SA
• Yan Wang · Chongqing, CN
• Alain Duboust · Sunnyvale, US
• Daniel Carl · Pleasanton, US
• Ralph Wadensweiler · Sunnyvale, US
• Manoocher Birang · Los Gatos, US
• Paul D. Butterfield · San Jose, US
• Rashid Mavliev · Truckee, US
• Stan Tsai · Clifton Park, US
• You Wang · Cupertino, US
• Jie Diao · Fremont, US
• Renhe Jia · Naperville, US
• Lakshmanan Karuppiah · San Jose, US
• Robert Ewald · Capitola, US

Key dates

• Filing date: Oct 31, 2006
• Grant date: Mar 18, 2008
• Expiry date: Oct 31, 2026

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B82Y30/00
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

An article of manufacture and apparatus are provided for processing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive polishing surface. An electrode is disposed below the polishing surface having a dielectric material therebetween. A plurality of apertures may be formed in the polishing surface and the dielectric material to at least partially expose the electrode to the polishing surface. A membrane may be disposed between the electrode and the polishing surface that is permeable to ions and current to promote continuity between the electrode and the polishing surface.