Adaptive control method for rapid thermal processing of a substrate
US7398693B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2006 |
| Grant date | Jul 15, 2008 |
| Priority date | — |
| Expiry date | Oct 23, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention generally relates to methods for the rapid thermal processing (RTP) of a substrate. Embodiments of the invention include controlling a thermal process using either a real-time adaptive control algorithm or by using a control algorithm that is selected from a suite of fixed control algorithms designed for a variety of substrate types. Selection of the control algorithm is based on optical properties of the substrate measured during the thermal process. In one embodiment, a combination of control algorithms are used, wherein the majority of lamp groupings are controlled with a fixed control algorithm and a substantially smaller number of lamp zones are controlled by an adaptive control algorithm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.