Multiple frequency plasma processor method and apparatus
US7405521B2 · kind B2 · utility
24Cited by
24References
45Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2003 |
| Grant date | Jul 29, 2008 |
| Priority date | — |
| Expiry date | Apr 29, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32165
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A workpiece is processed with a plasma in a vacuum plasma processing chamber by exciting the plasma at several frequencies such that the excitation of the plasma by the several frequencies simultaneously causes several different phenomena to occur in the plasma. The chamber includes central top and bottom electrodes and a peripheral top and/or bottom electrode arrangement that is either powered by RF or is connected to a reference potential by a filter arrangement that passes at least one of the plasma excitation frequencies to the exclusion of other frequencies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.