Method to improve time dependent dielectric breakdown

US7473636B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Kaushik Chanda · Fishkill, US
• James J. Demarest · Rensselaer, US
• Ronald G. Filippi · Wappingers Falls, US
• Roy Iggulden · Newburgh, US
• Edward W. Kiewra · Burlington, US
• Vincent J. McGahay · Poughkeepsie, US
• Ping-Chuan Wang · Hopewell Junction, US
• Yun-Yu Wang · Poughquag, US

Key dates

• Filing date: Jan 12, 2006
• Grant date: Jan 6, 2009
• Expiry date: Jan 24, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In the back end of an integrated circuit employing dual-damascene interconnects, the interconnect members have a first non-conformal liner that has a thicker portion at the top of the trench level of the interconnect; and a conformal second liner that combines with the first liner to block diffusion of the metal fill material.