Patent · US Active

Semiconductor module

US7759163B2 · kind B2 · utility

35Cited by

6References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Werner Kroeninger · Regensburg, DE
Josef Schwaiger · Teugn, DE
Ludwig Schneider · Parkstetten, DE
Ottmar Geitner · Pentling, DE
Markus Brunnbauer · Lappersdorf, DE
Thorsten Meyer · Regensburg, DE
Ralf Otremba · Kaufbeuren, DE
Josef Hoeglauer · Munich, DE
Helmut Strack · Hersbruck, DE
Xaver Schloegel · Sachsenkam, DE

Key dates

Filing date	Apr 18, 2008
Grant date	Jul 20, 2010
Priority date	—
Expiry date	Apr 18, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor module. One embodiment provides at least two semiconductor chips placed on a carrier. The at least two semiconductor chips are then covered with a molding material to form a molded body. The molded body is thinned until the at least two semiconductor chips are exposed. Then, the carrier is removed from the at least two semiconductor chips. The at least two semiconductor chips are singulated.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.