Substrate support having heat transfer system
US7768765B2 · kind B2 · utility
5Cited by
41References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2007 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Mar 8, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A support for a substrate processing chamber comprises a fluid circulating reservoir comprising a channel having serpentine convolutions. A fluid inlet supplies a heat transfer fluid to the fluid circulating reservoir and a fluid outlet discharges the heat transfer fluid. In one version, the channel is doubled over to turn back upon itself.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.