Patent · US Active

Semiconductor component with plastic housing, and process for producing the same

US7772105B2 · kind B2 · utility

0Cited by

9References

8Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ulrich Bachmaier · Ruderting, DE
Michael Bauer · Nittendorf, DE
Robert-Christian Hagen · Sarching, DE
Jens Pohl · San Luis Obispo, US
Rainer Steiner · Regensburg, DE
Peter Strobel · Regensburg, DE
Hermann Vilsmeier · Regensburg, DE
Holger Woerner · Regensburg, DE
Bernhard Zuhr · Regensburg, DE

Key dates

Filing date	Oct 26, 2007
Grant date	Aug 10, 2010
Priority date	—
Expiry date	May 20, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.