Method of fabricating a stacked die having a recess in a die BGA package
US7799610B2 · kind B2 · utility
4Cited by
60References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2007 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Oct 15, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.