Overlay metrology and control method

US7804994B2 · kind B2 · utility

Assignee

• KLA-Tencor Technologies Corp. · US

Inventors

• Michael Adel · Zichron Ya'akov, IL
• Mark Ghinovker · Migdal HaEmek, IL
• Elyakim Kassel · Kiryat Shmona, IL
• Boris Golovanevsky · Haifa, IL
• John Robinson · Austin, US
• Chris Mack · Austin, US
• Jorge Poplawski · Haifa, IL
• Pavel Izikson · Haifa, IL
• Moshe E. Preil · Sunnyvale, US

Key dates

• Filing date: Feb 13, 2003
• Grant date: Sep 28, 2010
• Expiry date: Aug 18, 2026

Classification

• Technology area (CPC G): Physics
• CPC primary: G03F9/7011
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An overlay method for determining the overlay error of a device structure formed during semiconductor processing is disclosed. The overlay method includes producing calibration data that contains overlay information relating the overlay error of a first target at a first location to the overlay error of a second target at a second location for a given set of process conditions. The overlay method also includes producing production data that contains overlay information associated with a production target formed with the device structure. The overlay method further includes correcting the overlay error of the production target based on the calibration data.