Method of correcting baseline skew by a novel motorized source coil assembly
US8062472B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2007 |
| Grant date | Nov 22, 2011 |
| Priority date | — |
| Expiry date | May 7, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32174
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention generally provides apparatus and method for adjusting plasma density distribution in an inductively coupled plasma chamber. One embodiment of the present invention provides an apparatus configured for processing a substrate. The apparatus comprises a chamber body defining a process volume configured to process the substrate therein, and a coil assembly coupled to the chamber body outside the process volume, wherein the coil assembly comprises a coil mounting plate, a first coil antenna mounted on the coil mounting plate, and a coil adjusting mechanism configured to adjust the alignment of the first coil antenna relative to the process volume.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.