Temperature uniformity measurement during thermal processing
US8109669B2 · kind B2 · utility
5Cited by
10References
20Claims
0Family size
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Key dates
| Filing date | Nov 19, 2008 |
| Grant date | Feb 7, 2012 |
| Priority date | — |
| Expiry date | Oct 2, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/48
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and systems for determining a radial differential metrology profile of a substrate heated in a process chamber is provided. Methods and systems for determining an angular or azimuthal differential metrology profile of a rotating substrate in a processing chamber are also provided. The radial and azimuthal differential metrology profiles are applied to adjust a reference metrology profile to provide a Virtual metrology of the process chamber. The virtual metrology is applied to control the performance of the process chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.