Temperature measurement and control of wafer support in thermal processing chamber
US8222574B2 · kind B2 · utility
46Cited by
64References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2008 |
| Grant date | Jul 17, 2012 |
| Priority date | — |
| Expiry date | Jan 4, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67248
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus and methods for achieving uniform heating or cooling of a substrate during a rapid thermal process are disclosed. More particularly, apparatus and methods for controlling the temperature of an edge ring supporting a substrate and/or a reflector plate during a rapid thermal process to improve temperature uniformity across the substrate are disclosed, which include a thermal mass or plate adjacent the edge ring to heat or cool the edge ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.