Substrate support having fluid channel
US8279577B2 · kind B2 · utility
5Cited by
54References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2010 |
| Grant date | Oct 2, 2012 |
| Priority date | — |
| Expiry date | Aug 2, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A support for a substrate processing chamber comprises a chuck having a substrate receiving surface, and a base comprising an upper wall comprising a recessed trench having (i) an attachment face at a first depth, and (ii) a fluid channel at a second depth. A lower wall is seated in the recessed trench and attached to the attachment face of the upper wall, to close the fluid channel. A fluid inlet is provided to supply a heat transfer fluid to the fluid channel and a fluid outlet provided to discharge the heat transfer fluid from the fluid channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.