Rapid thermal processing chamber with micro-positioning system
US8314371B2 · kind B2 · utility
14Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2009 |
| Grant date | Nov 20, 2012 |
| Priority date | — |
| Expiry date | Apr 9, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.