Patent · US Active

Stacked die in die BGA package

US8373277B2 · kind B2 · utility

4Cited by
63References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 28, 2008
Grant dateFeb 12, 2013
Priority date—
Expiry dateOct 22, 2028

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/15311
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.