Stacked via structure for metal fuse applications

US8633707B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Ronald G. Filippi · Wappingers Falls, US
• Griselda Bonilla · Hopewell Junction, US
• Kaushik Chanda · Fishkill, US
• Stephan Grunow · Poughkeepsie, US
• Naftali E. Lustig · Ossining, US
• Andrew H. Simon · Fishkill, US
• Ping-Chuan Wang · Hopewell Junction, US

Key dates

• Filing date: Mar 29, 2011
• Grant date: Jan 21, 2014
• Expiry date: Apr 10, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A back end of the line (BEOL) fuse structure having a stack of vias. The stacking of vias leads to high aspect ratios making liner and seed coverage inside the vias poorer. The weakness of the liner and seed layers leads to a higher probability of electromigration (EM) failure. The fuse structure addresses failures due to poor liner and seed coverage. Design features permit determining where failures occur, determining the extent of the damaged region after fuse programming and preventing further propagation of the damaged dielectric region.