Inventor · Fishkill, NY, US

Andrew H. Simon

113Patents
18h-index
156Co-inventors
89Inventor score

Filing activity: Apr 7, 1980 → Sep 8, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US6181012A Copper interconnection structure incorporating a metal seed layer Electricity 185 Expired
US5933753A Open-bottomed via liner structure and method for fabricating same Electricity 160 Expired
US6123825A Electromigration-resistant copper microstructure and process of making Emerging Cross-Sectional Technologies 60 Expired
US6399496B1 Copper interconnection structure incorporating a metal seed layer Electricity 53 Expired
US6975032B2 Copper recess process with application to selective capping and electroless plating Electricity 51 Expired
US7446036B1 Gap free anchored conductor and dielectric structure and method for fabrication thereof Electricity 37 Active
US6924223B2 Method of forming a metal layer using an intermittent precursor gas flow process Electricity 37 Expired
US5268069A Safe method for etching silicon dioxide Electricity 33 Expired
US6784105B1 Simultaneous native oxide removal and metal neutral deposition method Electricity 23 Expired
US6337151B1 Graded composition diffusion barriers for chip wiring applications Emerging Cross-Sectional Technologies 23 Expired
US9502350B1 Interconnect scaling method including forming dielectric layer over subtractively etched first conductive layer and forming second conductive material on dielectric layer Electricity 22 Active
US9601426B1 Interconnect structure having subtractive etch feature and damascene feature Electricity 21 Active
US4323398A Performing maintenance operations on heat exchanger tube bundles Performing Operations; Transporting 20 Expired
US10177031B2 Subtractive etch interconnects Electricity 19 Active
US6949461B2 Method for depositing a metal layer on a semiconductor interconnect structure Electricity 18 Expired
US6960519B1 Interconnect structure improvements Electricity 18 Expired
US7405147B2 Device and methodology for reducing effective dielectric constant in semiconductor devices Emerging Cross-Sectional Technologies 18 Expired
US8056039B2 Interconnect structure for integrated circuits having improved electromigration characteristics Electricity 18 Active
US8232646B2 Interconnect structure for integrated circuits having enhanced electromigration resistance Electricity 17 Active
US9171801B2 E-fuse with hybrid metallization Electricity 17 Active
US9679810B1 Integrated circuit having improved electromigration performance and method of forming same Electricity 16 Active
US6958540B2 Dual damascene interconnect structures having different materials for line and via conductors Electricity 16 Expired
US8232148B2 Structure and method to make replacement metal gate and contact metal Electricity 16 Active
US6380075B1 Method for forming an open-bottom liner for a conductor in an electronic structure and device formed Electricity 16 Expired
US6465376B2 Method and structure for improving electromigration of chip interconnects Emerging Cross-Sectional Technologies 14 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.