Methods and apparatus for pre-chemical mechanical planarization buffing module
US8968055B2 · kind B2 · utility
6Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2012 |
| Grant date | Mar 3, 2015 |
| Priority date | — |
| Expiry date | Feb 12, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B41/068
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides methods and apparatus for a pre-CMP semiconductor substrate buffing module. The invention includes a polishing pad assembly adapted to be rotated against a major surface of a substrate; a chuck adapted to hold the substrate and to rotate the substrate against the polishing pad assembly as the polishing pad assembly is rotated; and a lateral motion motor adapted to oscillate the polishing pad assembly laterally across the major surface of the substrate while the polishing pad assembly is rotated against the rotating substrate. Numerous additional features are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.