Shields for magnetic memory chip packages

US9070692B2 · kind B2 · utility

Assignee

• Avalanche Technology, Inc. · US

Inventors

• Yuchen Zhou · San Jose, US
• Bernardo Sardinha · Gilroy, US
• Rajiv Yadav Ranjan · San Jose, US
• Ebrahim Abedifard · Sunnyvale, US
• Roger Klas Malmhall · San Jose, US
• Zihui Wang · Milpitas, US
• Yiming Huai · Pleasanton, US
• Jing Zhang · Los Altos, US

Key dates

• Filing date: Jan 12, 2013
• Grant date: Jun 30, 2015
• Expiry date: Jul 7, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Chip packages are described with soft-magnetic shields that are included inside or attached externally to the package containing a MRAM chip. In one group of embodiments a single shield with vias for bonding wires is affixed to the surface of the MRAM chip having the contact pads. The limitation of shield to chip distance due to bonding wire is eliminated by VIA holes according to the invention which achieves minimal spacing between the shield and chip. A second shield without vias can be positioned on the opposite side of the chip from the first shield. In one group of embodiments a hardened ferro-fluid shield can be the only shield or the structure can include a shield with or without vias. One group of embodiments includes an external shield with vias for solder access to the package contact pads affixed to the outer surface of the package.