Method for singulating electronic components from a substrate
US9142434B2 · kind B2 · utility
2Cited by
8References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2008 |
| Grant date | Sep 22, 2015 |
| Priority date | — |
| Expiry date | Aug 15, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for forming electronic assemblies are provided. A device substrate having a plurality of electronic components embedded therein is provided. The device substrate is attached to a carrier substrate using an adhesive material. A plurality of cuts are formed through the device substrate to divide the device substrate into a plurality of portions. Each of the plurality of portions includes at least one of the electronic components. A force is applied to each of the plurality of portions in a direction away from the carrier substrate to remove the plurality of portions from the carrier substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.