Patent · US Active

E-fuse with hybrid metallization

US9171801B2 · kind B2 · utility

17Cited by
37References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 30, 2014
Grant dateOct 27, 2015
Priority date
Expiry dateMay 30, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A structure including a first interconnect including a first line overlying a first via and a second interconnect including a second line overlying a second via. The first line and the second line are co-planar. The first interconnect comprises a first conductor, the first conductor comprises a metal silicide including titanium silicide, cobalt silicide, nickel silicide, tungsten silicide, platinum silicide, molybdenum silicide, tantalum silicide, or some combination thereof. The second interconnect comprises a second conductor, the second conductor comprising copper.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.