Apparatus for controlling the temperature uniformity of a substrate
US9267742B2 · kind B2 · utility
4Cited by
8References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2010 |
| Grant date | Feb 23, 2016 |
| Priority date | — |
| Expiry date | Oct 31, 2033 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2013/001
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Apparatus for controlling the thermal uniformity of a substrate. In some embodiments, the thermal uniformity of the substrate is controlled to be more uniform. In some embodiments, the thermal uniformity of the substrate is controlled to be non-uniform in a desired pattern. In some embodiments, an apparatus for controlling thermal uniformity of a substrate includes a substrate support having a support surface to support a substrate thereon. A plurality of flow paths having a substantially equivalent fluid conductance are disposed within the substrate support to flow a heat transfer fluid beneath the support surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.