Support cylinder for thermal processing chamber

US9385004B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Mehran Behdjat · San Jose, US
• Aaron Muir Hunter · Santa Cruz, US
• Joseph M. Ranish · San Jose, US
• Norman L. Tam · Cupertino, US
• Jeffrey Tobin · Mountain View, US
• Jiping Li · Nanhu, CN
• Martin Tran · Santa Clara, US

Key dates

• Filing date: Jun 6, 2014
• Grant date: Jul 5, 2016
• Expiry date: Jun 6, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68757
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of the disclosure generally relate to a support cylinder used in a thermal process chamber. In one embodiment, the support cylinder comprises a ring body having an inner peripheral surface and an outer peripheral surface, wherein the ring body comprises an opaque quartz glass material and wherein the ring body is coated with an optical transparent layer. The optical transparent layer has a coefficient of thermal expansion that is substantially matched or similar to the opaque quartz glass material to reduce thermal expansion mismatch that may cause thermal stress under high thermal loads. In one example, the opaque quartz glass material is synthetic black quartz and the optical transparent layer comprises a clear fused quartz material.