Rapid thermal processing chamber with micro-positioning system
US9390950B2 · kind B2 · utility
7Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2014 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | Jan 15, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.