Thermal hot spot cooling for semiconductor devices
US9401315B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2015 |
| Grant date | Jul 26, 2016 |
| Priority date | — |
| Expiry date | Mar 26, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package which includes a semiconductor package, a semiconductor device joined to the semiconductor package; and a lid to be placed over the semiconductor device and joined to the semiconductor package. The lid includes: a block of a first material having a first surface and a second surface, the second surface facing the semiconductor device, the block having perforations extending between the first surface and the second surface; inserts for filling the perforations, each of the inserts being made of a second material, at least one of the inserts protrudes beyond the second surface towards the semiconductor device; and a bonding material to bond the inserts to the block so that the at least one of the inserts protrudes beyond the second surface towards the semiconductor device. Also included is a method of assembling a semiconductor device package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.