Enabling large feature alignment marks with sidewall image transfer patterning
US9536744B1 · kind B1 · utility
4Cited by
10References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2015 |
| Grant date | Jan 3, 2017 |
| Priority date | — |
| Expiry date | Dec 17, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54453
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an embodiment, this disclosure relates to a method of creating an alignment feature within a sidewall image transfer process by the addition of a block mask. The presence of the alignment feature would enable better overlay and alignment for subsequent lithographic stacks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.