Sivananda K. Kanakasabapathy
204Patents
16h-index
148Co-inventors
89Inventor score
Filing activity: Mar 28, 2001 → Oct 5, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8637384B2 | FinFET parasitic capacitance reduction using air gap | Electricity | 355 | Active |
| US8637930B2 | FinFET parasitic capacitance reduction using air gap | Electricity | 83 | Active |
| US8298943B1 | Self aligning via patterning | Electricity | 53 | Active |
| US9287135B1 | Sidewall image transfer process for fin patterning | Electricity | 44 | Active |
| US8358012B2 | Metal semiconductor alloy structure for low contact resistance | Electricity | 37 | Active |
| US9589845B1 | Fin cut enabling single diffusion breaks | Electricity | 34 | Active |
| US8420464B2 | Spacer as hard mask scheme for in-situ doping in CMOS finFETs | Electricity | 28 | Active |
| US7112861B2 | Magnetic tunnel junction cap structure and method for forming the same | Electricity | 25 | Expired |
| US9209178B2 | finFET isolation by selective cyclic etch | Emerging Cross-Sectional Technologies | 24 | Active |
| US8455364B2 | Sidewall image transfer using the lithographic stack as the mandrel | Electricity | 22 | Active |
| US9472506B2 | Registration mark formation during sidewall image transfer process | Electricity | 22 | Active |
| US9543435B1 | Asymmetric multi-gate finFET | Electricity | 19 | Active |
| US9431399B1 | Method for forming merged contact for semiconductor device | Electricity | 18 | Active |
| US9721848B1 | Cutting fins and gates in CMOS devices | Electricity | 17 | Active |
| US7642147B1 | Methods for removing sidewall spacers | Electricity | 17 | Active |
| US9741823B1 | Fin cut during replacement gate formation | Electricity | 16 | Active |
| US7825000B2 | Method for integration of magnetic random access memories with improved lithographic alignment to magnetic tunnel junctions | Emerging Cross-Sectional Technologies | 16 | Active |
| US7531367B2 | Utilizing sidewall spacer features to form magnetic tunnel junctions in an integrated circuit | Electricity | 16 | Active |
| US9991156B2 | Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs | Electricity | 14 | Active |
| US8586478B2 | Method of making a semiconductor device | Electricity | 14 | Active |
| US9754798B1 | Hybridization fin reveal for uniform fin reveal depth across different fin pitches | Electricity | 13 | Active |
| US9305845B2 | Self-aligned quadruple patterning process | Emerging Cross-Sectional Technologies | 13 | Active |
| US8735296B2 | Method of simultaneously forming multiple structures having different critical dimensions using sidewall transfer | Electricity | 13 | Active |
| US9064813B2 | Trench patterning with block first sidewall image transfer | Electricity | 13 | Active |
| US8518824B2 | Self aligning via patterning | Electricity | 13 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.