Patent · US Active

Method of manufacturing an electronic device having a contact pad with partially sealed pores

US9620466B1 · kind B1 · utility

3Cited by

1References

18Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Martin Mischitz · Wernberg, AT
Markus Heinrici · Klagenfurt, AT
Barbara Eichinger · Villach, AT
Manfred Schneegans · Vaterstetten, DE
Stefan Krivec · Villach, AT

Key dates

Filing date	Nov 30, 2015
Grant date	Apr 11, 2017
Priority date	—
Expiry date	Nov 30, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/35121
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of manufacturing an electronic device may include: forming at least one electronic component in a substrate; forming a contact pad in electrical contact with the at least one electronic component; wherein forming the contact pad includes: forming a first layer over the substrate; planarizing the first layer to form a planarized surface of the first layer; and forming a second layer over the planarized surface, wherein the second layer has a lower porosity than the first layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.